The core of DTU Danchip's services is to make it possible for our customers to develop new technology and new products based on top-down micro- and nanotechnology. The physical outputs of this process are small chips, with feature sizes down to a few nanometers. When manufacturing devices in this order of magnitude, the presence of dust particles proves to be very critical, hence cleanrooms are an absolute necessity.
The cleanroom facility at DTU Danchip's consists of 1350 m² total laboratory area with a mixture of different classes of cleanroom space, hosting a large range of activities within micro- and nanotechnology.
Simply put, the core technologies of DTU Danchip are two-fold, which is combinations can create 3-dimensional structures with a given functionality. One key process is to create thin films with a thickness from a few nanometers to many micrometers. The other is etching holes in the film after a selective pattern, using very advanced etching techniques. These techniques have been adapted to the multi-disciplinary research and pilot-production environment, which has evolved since 1993 with special focus on topics like MEMS, optical communication, µ-fluidics, and biochemical applications.
Since August 1993, a complete 4” wafer line has been in operation and we are currently working towards the implementation of a complete 6” wafer line. The cleanroom comprises of both mixed and dedicated room arrangements. The addition of the electron beam lithography competences back in 2004 decisively launched our activitities into nanotechnology.
To understand how we can assist you, take a tour of our cleanroom facility, have a look at the complete portfolio of equipment, or get understanding of the basic processes cost for creating typical nanostructures.