DTU Danchip


The core of DTU Danchip's services is to make it possible for our customers to develop new technology and new products based on top-down micro- and nanotechnology. The physical outputs of this process are small chips, with feature sizes down to a few nanometers. When manufacturing devices in this order of magnitude, the presence of dust particles proves to be very critical, hence cleanrooms are an absolute necessity.

The cleanroom facility at DTU Danchip's consists of 1350 m² total laboratory area with a mixture of different classes of cleanroom space, hosting a large range of activities within micro- and nanotechnology.

Simply put, the core technologies of DTU Danchip are two-fold, which is combinations can create 3-dimensional structures with a given functionality. One key process is to create thin films with a thickness from a few nanometers to many micrometers. The other is etching holes in the film after a selective pattern, using very advanced etching techniques. These techniques have been adapted to the multi-disciplinary research and pilot-production environment, which has evolved since 1993 with special focus on topics like MEMS, optical communication, µ-fluidics, and biochemical applications.

To understand how we can assist you, take a tour of our cleanroom facility, have a look at the complete portfolio of equipment, or get understanding of the basic processes cost for creating typical nanostructures.


Single chips
2” (50 mm)
3” (75 mm)
4” (100 mm)
6” (150 mm)
8” (200 mm)

Electron beam lithography (20 nm)
Deep Ultraviolet Stepper
technology (220 nm)
Nano-imprint lithography (50 nm)
UV lithography (1 μm).

Material Deposition
Plasma-enhanced, e-beam
evaporated and sputtering of:
metals, dielectrics, III-V alloys,
polymers, magnetic materials,
graphene and carbon nanotubes.
Electroplating, polymer
injection moulding.

Dry and wet-etching of metals, dielectrica, III-V alloys, polymers.

Thermal processing
Annealing, doping, oxidation

Scanning Electron Microscopy
Atomic Force Microscopy
Dektak Stylus Profilometry
3D Optical Profilometry
Secondary Ion Mass Spectroscopy
X-ray Photoelectron Spectroscopy
Photoluminescence mapping
Drop-Shape analyzing
Probe stations

Back-End processing
Wire and die bonding
Dicing, sawing